Warpage Issues and Assembly Challenges Using Coreless ...

由 B Hsu 著作 · 2010 · 被引用 4 次 — Abstract: The rational of using the coreless technology to build packaging substrates versus the conventional core approach is first described.

由 BK Appelt 著作 · 2010 · 被引用 5 次 — The concept of coreless organic substrates is inspired by multi-layer ceramic substrate. The ceramic technology uses metal filled vias to interconnect adjacent ...

Based on the stacked shell elements, a new technique is used to study the laminated thin plate with arbitrary number and oriented plies. The stacked shells are ...

ACCESS is a world leader in advanced organic coreless substrate technology. Recognized as an international pioneer in the semiconductor industry, ...

Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter, smaller and superior electrical performance regarding ...

由 M Manusharow 著作 · 2012 · 被引用 12 次 — This paper reviews the design strategies implemented and characterization data collected to achieve matched electrical performance with the existing cored ...

SHINKO supplies coreless substrates which are thin build-up substrates made by removing a core layer for memory or others use in sophisticated small electronic ...

由 J Kim 著作 · 被引用 33 次 — Abstract. Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter, smaller and.